Diamond Dicing Saw Diamond Slicing Saw for R & D and ...
2010-11-2 · New CE certified Precision Diamond Slicing Dicing Saw is designed for Laboratory and R & D use. This machine can be used for slicing, dicing or cutting all kinds of materials up 4' diameter wafer or rectangular material up to 8' length x 4' width x 1'in depth saw is fully controlled by a computer ( any PC or Desktop computer) with position accuracy of 0.01 mm or better.
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